Heterogeneous Integration Hybrid Substrate with Ajinomoto Build-Up Film
نویسندگان
چکیده
The design, materials, process, and fabrication of a hybrid substrate for the heterogeneous integration chips with 50μm-pitch (minimum) by fan-out chip-last panel-level packaging are presented. consists fine metal linewidth (L), spacing (S), thickness (H) RDL (redistribution-layer) substrate, solder joints underfill, build-up package substrate. dielectric material L/S/H RDL-substrate is an Ajinomoto film (ABF).
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ژورنال
عنوان ژورنال: IMAPS symposia and conferences
سال: 2023
ISSN: ['2380-4505']
DOI: https://doi.org/10.4071/001c.74589